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The effect of Te doping on the electronic structure and thermoelectric properties of SnSe

机译:Te掺杂对SnSe电子结构和热电性能的影响

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SnSe _(1-x)Te _x (x=0, 0.0625) bulk materials were fabricated by melting Sn, Se and Te powders and then hot pressing them at various temperatures. The phase compositions of the materials were determined by X-ray diffraction (XRD) and the crystal lattice parameters were refined by the Rietveld method performed with DBWS. XRD analysis revealed that the grains in the materials preferentially grew along the (l 0 0) directions. The structural behavior of SnSe _(1-x)Te _x (x=0, 0.0625) was calculated using CASTEP package provided by Materials Studio. We found that the band gap of SnSe reduced from 0.643 to 0.608 eV after Te doping. The calculated results were in good agreement with experimental results. The electrical conductivity and the Seebeck coefficient of the as-prepared materials were measured from room temperature to 673 K. The maximum power factor of SnSe is ~0.7 μW cm ~(-1)K ~(-2) at 673 K.
机译:SnSe _(1-x)Te _x(x = 0,0.0625)块状材料是通过熔化Sn,Se和Te粉末,然后在各种温度下热压而制成的。通过X射线衍射(XRD)确定材料的相组成,并通过使用DBWS进行的Rietveld方法精制晶格参数。 XRD分析表明,材料中的晶粒优先沿(l 0 0)方向生长。使用Materials Studio提供的CASTEP软件包计算SnSe _(1-x)Te _x(x = 0,0.0625)的结构行为。我们发现,Te掺杂后,SnSe的带隙从0.643 eV减小到0.608 eV。计算结果与实验结果吻合良好。在室温至673 K的温度下测量所制备材料的电导率和塞贝克系数。在673 K时,SnSe的最大功率因数约为〜0.7μWcm〜(-1)K〜(-2)。

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