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Silicon wet etching: Hillock formation mechanisms and dynamic scaling properties

机译:硅湿蚀刻:Hillock形成机理和动态结垢特性

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Surface roughening due to anisotropic wet etching of silicon was studied experimentally and modeled using the Monte Carlo method. Simulations were used to determine the consequences of site-dependent detachment probabilities on surface morphology for a one- and two-dimensional substrate models, focusing on the formation mechanisms of etch hillocks. Dynamic scaling properties of the 1D model were also studied. Resorting to the height-height correlation function and the structure factor, it is shown that the model presents conventional and anomalous scaling (faceted) depending on the stability of the hillocks tops. We also found that there is an intermediate regime that cannot be described by the Family-Vicsek or anomalous scaling ansatz.
机译:实验研究了由于硅的各向异性湿法蚀刻而引起的表面粗糙化,并使用蒙特卡洛方法进行了建模。对于一维和二维衬底模型,使用模拟来确定依赖于位置的分离概率对表面形态的影响,重点是蚀刻岗的形成机理。还研究了一维模型的动态缩放特性。借助于高度-高度相关函数和结构因子,表明该模型根据丘顶的稳定性提出了常规的和异常的缩放比例(刻面的)。我们还发现,有一个中间状态无法用Family-Vicsek或异常缩放ansatz来描述。

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