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Compatibility of the selective area growth of GaN nanowires on AIN-buffered Si substrates with the operation of light emitting diodes

机译:AIN缓冲Si衬底上GaN纳米线的选择性区域生长与发光二极管的兼容性

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AIN layers with thicknesses between 2 and 14 nm were grown on Si(111) substrates by molecular beam epitaxy. The effect of the AIN layer thickness on the morphology and nucleation time of spontaneously formed GaN nanowires (NWs) was investigated by scanning electron microscopy and line-of-sight quadrupole mass spectrometry, respectively. We observed that the alignment of the NWs grown on these layers improves with increasing layer thickness while their nucleation time decreases. Our results show that 4 nm is the smallest thickness of the AIN layer that allows the growth of well-aligned NWs with short nucleation time. Such an AIN buffer layer was successfully employed, together with a patterned SiOx mask, for the selective-area growth (SAG) of vertical GaN NWs. In addition, we fabricated light-emitting diodes (LEDs) from NW ensembles that were grown by means of self-organization phenomena on bare and on AINbuffered Si substrates. A careful characterization of the optoelectronic properties of the two devices showed that the performance of NW-LEDs on bare and AIN-buffered Si is similar. Electrical conduction across the AIN buffer is facilitated by a high number of grain boundaries that were revealed by transmission electron microscopy. These results demonstrate that grainy AIN buffer layers on Si are compatible both with the SAG of GaN NWs and LED operation. Therefore, this study is a first step towards the fabrication of LEDs on Si substrates based on homogeneous NW ensembles.
机译:通过分子束外延在Si(111)衬底上生长厚度在2和14 nm之间的AlN层。分别通过扫描电子显微镜和视线四极杆质谱法研究了AIN层厚度对自发形成的GaN纳米线(NWs)的形态和成核时间的影响。我们观察到,在这些层上生长的NW的排列随层厚度的增加而提高,而其成核时间减少。我们的结果表明,4纳米是AIN层的最小厚度,它允许以短成核时间生长排列良好的NW。这种AIN缓冲层已与图案化的SiOx掩模一起成功用于垂直GaN NW的选择性区域生长(SAG)。此外,我们由NW组件制造了发光二极管(LED),这些组件是通过自组织现象在裸露的和AIN缓冲的Si衬底上生长的。仔细表征这两种器件的光电性能表明,在裸露和AIN缓冲的Si上,NW-LED的性能相似。透射电子显微镜显示的大量晶界促进了跨AIN缓冲区的导电。这些结果表明,Si上的颗粒状AIN缓冲层与GaN NW的SAG和LED操作均兼容。因此,这项研究是在基于均匀NW集成体的Si基板上制造LED的第一步。

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