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Fluorine-doped tin oxide films grown by pulsed direct current magnetron sputtering with an Sn target

机译:通过脉冲直流磁控溅射和Sn靶生长的掺氟氧化锡膜

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Fluorine-doped tin oxide (FTO) films have been deposited by pulsed DC magnetron sputtering with an Sn target. Various ratios of CF_(4)/O_(2) gas were injected to enhance the optical and electrical properties of the films. The extinction coefficient was lower than 1.5 X 10~(-3) in the range from 400 to 800 nm when the CF_(4)/O_(2) ratio was 0.375. The resistivity of fluorine-doped SnO_(2) films (1.63 X 10~(-3) (OMEGA)cm) deposited at 300 deg C was 27.9 times smaller than that of undoped SnO_(2) (4.55 X 10~(-2) (OMEGA)cm). Finally, an FTO film was consecutively deposited for protecting the oxidation of indium tin oxide films. The resistivity of the double-layered film was 2.68 X 10~(-4) (OMEGA)cm, which increased by less than 39percent at a 450 deg C annealing temperature for 1 h in air.
机译:氟掺杂的氧化锡(FTO)膜已通过带有Sn靶的脉冲直流磁控溅射沉积。注入不同比例的CF_(4)/ O_(2)气体以增强薄膜的光学和电学性质。当CF_(4)/ O_(2)比为0.375时,消光系数在400至800 nm范围内小于1.5 X 10〜(-3)。在300摄氏度下沉积的掺氟SnO_(2)膜(1.63 X 10〜(-3)(OMEGA)cm)的电阻率是未掺杂SnO_(2)(4.55 X 10〜(-2)的27.9倍)(OMEGA)cm)。最后,连续沉积FTO膜以保护氧化铟锡膜。双层膜的电阻率为2.68 X 10〜(-4)(OMEGA)cm,在空气中450摄氏度的退火温度下1 h,电阻率增加不到39%。

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