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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >An accurate drain current model of SOI high voltage lateral MOSFETs including self-heating effect
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An accurate drain current model of SOI high voltage lateral MOSFETs including self-heating effect

机译:具有自热效应的SOI高压横向MOSFET的精确漏极电流模型

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摘要

We have developed the nonisothermal drain current model of SOI high voltage (HV) lateral MOSFETs including the self-heating effect which is caused by the heat generated in high voltage integrated circuits and by the low thermal conductance. The thermal network of high voltage lateral MOSFETs is composed of the lumped heat capacitors, lumped thermal conductors and lumped heat sources considering the physical effect of isothermal drain current and transient temperature-rate with time. The simulation results using a nonisothermal circuit model show the negative differential resistance in I-V characteristics and have good agreement with the measurements when long pulses are applied to gate of high voltage lateral MOSFETs.
机译:我们已经开发了SOI高压(HV)横向MOSFET的非等温漏极电流模型,该模型包括自发热效应,该效应是由高压集成电路中产生的热量和低热导率引起的。考虑到等温漏极电流和瞬态温度速率随时间变化的物理效应,高压横向MOSFET的热网络由集总热电容器,集总热导体和集总热源组成。使用非等温电路模型的仿真结果显示了I-V特性中的负差分电阻,并且当向高压侧向MOSFET的栅极施加长脉冲时,其测量结果具有良好的一致性。

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