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Si/SiGe Continuous Epitaxial Growth Technology for High-Speed SiGe HBTs

机译:用于高速SiGe HBT的Si / SiGe连续外延生长技术

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摘要

A Continuous-epitaxial-growth technique, using a cold-wall rapid thermal UHV/CVD system, for Si/SiGe multilayers containing different doping types has been developed. Extremely high phosphorous-doping in the silicon layer grown by LPCVD with Si{sub}2H{sub}6 can be achieved without high-temperature activation annealing, and good crystallinity of the Si layer results in very low resistivity. High-temperature surface cleaning prior to the epitaxial growth can be omitted, since contamination occurring during wafer transfer was minimized by using a UHV transfer chamber. Good crystallinity of the HBT structure after the whole fabrication process was confirmed by reciprocal lattice space mapping of high-resolution X-ray diffraction. These results indicate that the developed continuous-epitaxial-growth technique gives a major advantage in maintaining crystal quality of Si/SiGe multi-layers for future ultra-high-speed devices.
机译:已经开发出一种使用冷壁快速热超高压/ CVD系统的连续外延生长技术,用于包含不同掺杂类型的Si / SiGe多层。在没有高温活化退火的情况下,可以实现通过具有Si {sub} 2H {sub} 6的LPCVD生长的硅层中极高的磷掺杂,并且Si层的良好结晶性导致非常低的电阻率。可以省略外延生长之前的高温表面清洁,因为通过使用UHV传输腔室可以最大程度地减少晶片传输过程中发生的污染。通过高分辨率X射线衍射的倒易晶格空间映射,证实了整个制造过程之后HBT结构的良好结晶性。这些结果表明,所开发的连续外延生长技术在保持未来超高速器件的Si / SiGe多层晶体质量方面具有主要优势。

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