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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >Preparation of Pb(Zr,Ti)O{sub}3 Thin Films by Sol-Gel Technique for Ferroelectric-Gate Thin Film Transistor Applications
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Preparation of Pb(Zr,Ti)O{sub}3 Thin Films by Sol-Gel Technique for Ferroelectric-Gate Thin Film Transistor Applications

机译:溶胶-凝胶技术制备铁电门薄膜晶体管用Pb(Zr,Ti)O {sub} 3薄膜

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摘要

We have fabricated Pb(Zr,Ti)O{sub}3 (PZT) thin films by the sol-gel technique for thin film transistor applications. It is found that the PZT films fabricated with low-pressure consolidation process show excellent electrical properties and surface morphologies. A remanent polarization (Pr) and coercive field (E{sub}c) of the PZT thin films crystallized at 600℃ are 35μC/cm{sup}2 and 64kV/cm, respectively. We next apply this PZT film to fabricate thin film transistors using indium tin oxide (ITO) as a channel layer. It is demonstrated that the PZT/ITO thin film transistor has good transistor characteristics with nonvolatile memory function.
机译:我们已经通过溶胶-凝胶技术制备了Pb(Zr,Ti)O {sub} 3(PZT)薄膜,用于薄膜晶体管应用。发现用低压固结工艺制造的PZT膜显示出优异的电性能和表面形态。在600℃结晶的PZT薄膜的剩余极化(Pr)和矫顽场(E {sub} c)分别为35μC/ cm {sup} 2和64kV / cm。接下来,我们将该PZT膜应用于使用氧化铟锡(ITO)作为沟道层的薄膜晶体管的制造。证明了PZT / ITO薄膜晶体管具有良好的晶体管特性以及非易失性存储功能。

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