【24h】

Evaluation of low-k porous silica films incorporated with ethylene groups

机译:评估带有乙烯基的低k多孔二氧化硅薄膜

获取原文
获取原文并翻译 | 示例
           

摘要

Porous silica films incorporated with ethylene groups prepared by using hydrolysis and condensation of BIS(Triethoxysillyl)Ethylene [BTE] and H{sub}20 contained with HCl as a catayst and 2-Methylpentane-2,4-diol [MPD] ws evaluated. FTIR peaks due to MPD were not observed in the film even after 450℃. This result was also confirmed by thermal-programmed desorption [TPD] measurement. Electric characteristics were evaluated with MOS structure. The k value was not depend on the annealing temperature below 400℃, however, it was reduced down to 1.9 at 450℃. Density of the film evaluated by x-ray reflectance measurement was about 1.Og/cm{sup}3 and porosity was about 56%.
机译:通过使用BIS(三乙氧基甲硅烷基)乙烯[BTE]和H {sub} 20的水解和缩合制备的含有乙烯基的二氧化硅多孔膜,其中HCl作为催化剂,并评估了2-甲基戊烷-2,4-二醇[MPD]。即使在450℃后,膜中也未观察到MPD引起的FTIR峰。通过热程序解吸[TPD]测量也证实了该结果。用MOS结构评估电特性。 k值不依赖于低于400℃的退火温度,但是在450℃时降低到1.9。通过X射线反射率测量评估的膜的密度为约1.0g / cm 3,并且孔隙率为约56%。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号