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Characterization of low-k porous silica films incorporated with alkylene groups

机译:带有亚烷基的低k多孔二氧化硅薄膜的表征

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摘要

Alkylene groups incorporated porous silica films were prepared by using hydrolysis and condensation of BIS (Triethoxysilyl) Ethelene (BTE). BTE and H_2O containing HCl as a catalyst were mixed with organic solvent, 2-Methylpentane-2,4-diol (MPD). FT-IR peaks due to MPD were not observed but Si-C_2H_4-Si related peaks were still observed in the film even after 450 ℃ vacuum annealing. Electric characteristics were evaluated with an MOS structure. K value does not depend on the annealing temperature below 400 ℃; however, it was reduced down to 1.9 at 450 ℃.
机译:通过使用BIS(三乙氧基甲硅烷基)乙稀(BTE)的水解和缩合制备掺入亚烷基的多孔二氧化硅膜。将BTE和含HCl作为催化剂的H_2O与有机溶剂2-甲基戊烷-2,4-二醇(MPD)混合。即使在450℃真空退火后,仍未观察到由于MPD引起的FT-IR峰,但仍观察到了Si-C_2H_4-Si相关峰。用MOS结构评估电特性。 K值不取决于400℃以下的退火温度;然而,在450℃时降低到1.9。

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