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首页> 外文期刊>Computational Mechanics: Solids, Fluids, Fracture Transport Phenomena and Variational Methods >Degree of cure-dependent modelling for polymer curing processes at small-strain. Part I: consistent reformulation
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Degree of cure-dependent modelling for polymer curing processes at small-strain. Part I: consistent reformulation

机译:小应变下聚合物固化过程的依赖固化程度的建模。第一部分:一致的重新制定

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A physically-based small strain curing model has been developed and discussed in our previous contribution(Hossain et al. in Comput Mech 43:769–779, 2009a) which was extended later for finite strain elasticity and viscoelasticity including shrinkage in Hossain et al. (Comput Mech 44(5):621–630, 2009b) and in Hossain et al. (Comput Mech 46(3):363–375, 2010), respectively. The previously proposed constitutive models for curing processes are based on the temporal evolution of the material parameters, namely the shear modulus and the relaxation time (in the case of viscoelasticity). In the current paper, a thermodynamically consistent small strain constitutive model is formulated that is directly based on the degree of cure, a key parameter in the curing (reaction) kinetics. The new formulation is also in line with the earlier proposed hypoelastic approach. The curing process of polymers is a complex phenomenon involving a series of chemical reactions which transform a viscoelastic fluid into a viscoelastic solid during which the temperature, the chemistry and the mechanics are coupled. Part I of this work will deal with an isothermal viscoelastic formulation including shrinkage effectswhereas the following Part II will give emphasis on the thermomechanical coupled approach. Some representative numerical examples conclude the paper and show the capability of the newly proposed constitutive formulation to capture major phenomena observed during the curing processes of polymers.
机译:在我们先前的贡献(Hossain等人,Comput Mech 43:769-779,2009a)中,已经开发并讨论了基于物理的小应变固化模型,该模型后来在Hossain等人中扩展了有限应变弹性和粘弹性,包括收缩率。 (Comput Mech 44(5):621-630,2009b)和Hossain等人。 (Comput Mech 46(3):363-375,2010)。先前提出的固化过程本构模型基于材料参数的时间演变,即剪切模量和松弛时间(在粘弹性的情况下)。在当前的论文中,直接基于固化度(一种固化(反应)动力学的关键参数)建立了热力学一致的小应变本构模型。新的公式也与较早提出的次弹性方法一致。聚合物的固化过程是一个复杂的现象,涉及一系列化学反应,这些反应将粘弹性流体转化为粘弹性固体,在此过程中温度,化学和力学相互耦合。这项工作的第一部分将处理包括收缩效应在内的等温粘弹性公式,而以下第二部分将重点介绍热机械耦合方法。一些具有代表性的数值示例对本文进行了总结,并显示了新提出的本构配方能够捕获聚合物固化过程中观察到的主要现象的能力。

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