Analysis of the Influence of Quantum-Mechanical Processes on the Possibilities of Determining the Low Degree of Curing a Binder when Molding Products from Polymer Composite Materials

摘要

The quantum-mechanical nature of thermal processes in the diagnosis of incomplete curing of a polymer binder is considered in this article. The results obtained in the article may serve as a basis for further research in the development of diagnostic methods for determining the short state of an epoxy polymer with the use of ultrasonic, temperature, and magnetic phenomena.