Thermal Analysis of 'Device-Reflector' System to Optimize the Molding Conditions and Determine the Shape of Tooling to Ensure Minimal Deviation of Reflecting Surface from the Theoretical Shape in the Binder Curing Process

摘要

Background/Objectives: The relevance of the article is determined by the need to develop high-frequency wavelength bands which are possible to ensure when creating high-precision reflecting surface of the reflector. Methods: The authors used the finite element method and its implementation in the software package Siemens PLM NX for mathematical modeling of the binder polymerization process. Findings: In this article the thermal analysis of 'device-reflector' system is conducted, following the results of which molding conditions and shapes of reflector tooling are determined. These studies are carried out to provide minimal deviations of the reflecting surface from the theoretical shape in the curing process. A device model, its materials and their properties are described. The article provides insight into the features of structural modelling, such as assumptions of the geometrical model and boundary conditions of the problem. Computational results are presented which show temperature distribution in the reflector blank and device. Improvements/Novelty: Comparative analysis of the results shows that the use of thinner devices enables to significantly reduce the reflector thermal deformation level making only about 0.01 mm at the final stage of the process in the best model.