首页> 外文期刊>科儀新知 >Development of a Novel High-Speed and Controllable Position Platform with a Precision XYθ Stage
【24h】

Development of a Novel High-Speed and Controllable Position Platform with a Precision XYθ Stage

机译:新型具有精密XYθ工作台的高速可控位置平台的开发

获取原文
获取原文并翻译 | 示例
       

摘要

An XYC-axis precision feeding system was established into a novel high-speed and controllable position platform with a precision XYθ stage that combined with motion control, system integrated engineer, image alignment, and mask aligning techniques for laser direct imaging (LDI) processes. The developed system linked a PC-based controller, multi-axis measurement and error compensation techniques reached a high stiffness, high loading capability, high speed alignment, high precision, and high positioning repeatability. This system could be used in the alignment, fabrication, and inspection equipments for the advanced lithography industries such as printed circuit boards (PCBs), wafers, touch panels, integrated circuits (ICs), light emitting diodes (LEDs), and spare parts. In addition, the primary aims of this project were to design a mechanism with X and Y axes in a coplanarity and to adopt circular arc guideways in a C axis to improve the loading capability when moving the XYC axes simultaneously. The proposed system promotes the accuracy and efficiency of the alignment and position and the international competition ability for automation equipments. In the future, the controllable position platform will widely be installed in the advanced equipments for drilling and cutting of LED ceramic substrates, inspection of wafers, drilling of PCB substrates, laser edge isolation of thin-film solar cells, scribing or surface texturing of sapphires, and other tasks.
机译:将XYC轴精密进给系统建立到具有XYXY精密工作台的新型高速可控位置平台中,该平台与运动控制,系统集成工程师,图像对准和掩模对准技术相结合,用于激光直接成像(LDI)工艺。开发的系统连接了基于PC的控制器,多轴测量和误差补偿技术实现了高刚度,高负载能力,高速对准,高精度和高定位重复性。该系统可用于先进光刻行业的对准,制造和检查设备,例如印刷电路板(PCB),晶圆,触摸板,集成电路(IC),发光二极管(LED)和备件。另外,该项目的主要目的是设计一种X和Y轴共面的机构,并在C轴上采用圆弧导轨,以提高同时移动XYC轴时的负载能力。所提出的系统提高了对准和位置的准确性和效率,并提高了自动化设备的国际竞争力。将来,可控位置平台将广泛安装在先进的设备中,用于钻孔和切割LED陶瓷基板,检查晶圆,钻孔PCB基板,薄膜太阳能电池的激光边缘隔离,蓝宝石的划刻或表面纹理化,以及其他任务。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号