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Cohesive zone representation of crack and void growth in single crystal nickel via molecular dynamics simulation

机译:分子动力学模拟的单晶镍裂纹和空隙生长的内聚区表示

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摘要

Pre-existing center crack and void growth in single crystal nickel under Mode I loading are investigated by introducing a cohesive zone model (CZM) based on molecular dynamics (MD) simulation. The microstructural evolution and stress distribution during crack and void growth are analyzed as are the associated mechanical properties. The results indicate that the crack and void have different fracture mechanisms. Crack-tip blunting occurs due to the [110] super-dislocations emission during crack growth, while for void growth the primary micro-mechanism is the formation of stacking faults, which result in the different growth rates, opening displacements, and stress states. Based on the calculation of the CZM, the crack has a greater growth speed and opening displacement, but a lower tensile stress and fracture strain than the void under the same loading conditions, and the high stress is accompanied by microstructural evolution during crack and void growth. (C) 2015 Elsevier B.V. All rights reserved.
机译:通过引入基于分子动力学(MD)模拟的内聚区模型(CZM),研究了在模式I载荷下单晶镍中预先存在的中心裂纹和空隙的生长。分析了裂纹和空隙生长过程中的微观结构演变和应力分布,以及相关的力学性能。结果表明,裂纹和空隙具有不同的断裂机理。裂纹尖端钝化是由于裂纹扩展过程中[110]超位错发射而引起的,而对于空洞生长,主要的微观机制是堆积缺陷的形成,这导致了不同的生长速率,开口位移和应力状态。根据CZM的计算,在相同载荷条件下,裂纹的扩展速度和开裂位移均大于空隙,但拉伸应力和断裂应变要低,且高应力伴随裂纹和空隙扩展而产生微观结构。 (C)2015 Elsevier B.V.保留所有权利。

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