積層MEMS のためのパルスレーザー支援デブリフリー低ストレスダイシング技術

摘要

We developed a novel debris-free in-air laser dicing technology that gives greater design freedoms in the structure, the process, and the materials of MEMS as well as improves yields. Our technology combines two processes: dicing guide fabrication and wafer separation. The first process is an internal transformation using a fundamental wavelength of a Nd:YVO4 laser. The second process is mechanical separation by bending stress. The internal transformation in the first process worked well as a separation guide, and the processed wafer was diced with low stress. The diced lines completely followed the internal transformation.