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首页> 外文期刊>Journal of Tribology >Study of Wet Friction Material Test Under Severe Thermal and Mechanical Loading ('Bump Test')
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Study of Wet Friction Material Test Under Severe Thermal and Mechanical Loading ('Bump Test')

机译:热和机械载荷下的湿摩擦材料试验研究(“冲击试验”)

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摘要

One of the fatigue tests used for friction materials is the so called "bump test". In this test, one of the reaction disks in a pack of disks has machined bumps across the contact surface. These bumps generate locally high contact pressure and temperature. In this way, severe contact conditions like that arising in service can be reproduced. The major difficulty in utilizing the "bump test" is estimation of the local pressure and temperature. In this paper, a model is developed and experimental verification of thermoelastic contact is presented. The model represents a multi-surface contact problem for a pack of disks. Due to the presence of bumps, contact surfaces are not conforming. To solve this strongly nonlinear contact problem, a robust finite element code is used. The model also includes thermal effects generated by frictional heating. The coupled elastic contact and thermal problems are solved sequentially. Contact pressure at interfaces is measured in static conditions (without sliding) using pressure sensitive film. Good agreement between the model and the measurement is observed in sense of contact length and magnitude of pressure. In order to verify the full thermoelastic model, the transient temperature inside one of the disks is measured by thermocouples. The results agree with model predictions. The study shows that the local contact pressure is an order of magnitude higher than nominal pressure. Also temperatures are much higher than that predicted for uniform contact conditions. The developed model helps to understand complex thermoelastic effects accompanying the test and to control the test parameters.
机译:用于摩擦材料的疲劳测试之一是所谓的“碰撞测试”。在此测试中,一组磁盘中的一个反应磁盘在接触表面上形成了机械凸起。这些凸起会产生局部较高的接触压力和温度。以这种方式,可以再现诸如在使用中产生的严格的接触条件。利用“冲击测试”的主要困难是估计局部压力和温度。本文建立了一个模型,并提出了热弹性接触的实验验证。该模型表示一组磁盘的多表面接触问题。由于存在隆起,接触面不一致。为了解决这个强烈的非线性接触问题,使用了鲁棒的有限元代码。该模型还包括摩擦加热产生的热效应。依次解决了耦合的弹性接触和热问题。使用压敏薄膜在静态条件下(无滑动)测量界面处的接触压力。在接触长度和压力大小方面,可以观察到模型与测量结果之间的一致性。为了验证完整的热弹性模型,通过热电偶测量其中一个磁盘内部的瞬态温度。结果与模型预测一致。研究表明,局部接触压力比标称压力高一个数量级。温度也远高于均匀接触条件所预测的温度。开发的模型有助于了解伴随测试的复杂热弹性效应并控制测试参数。

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