首页> 外文期刊>Journal of the Science of Food and Agriculture >Effects of high temperature after pollination on physicochemical properties of waxy maize flour during grain development.
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Effects of high temperature after pollination on physicochemical properties of waxy maize flour during grain development.

机译:授粉后高温对蜡质玉米粉发育过程中理化特性的影响。

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Background. Waxy maize is grown in South China, where high temperatures frequently prevail. The effect of high-temperature stress on grain development of waxy maize is not known. Results. High temperature decreased the grain fresh weight and volume, and lowered the grain dry weight and water content after 22 days after pollination (DAP). Plants exposed to high temperature had low starch content, and high protein and soluble sugar contents at maturity. Starch iodine binding capacity and granule size were increased by heat stress at all grain-filling stages. The former parameter decreased, while the latter parameter increased gradually with grain development. High temperature increased the peak and breakdown viscosity before 30 DAP, but the value decreased at maturity. Pasting and gelatinization temperatures at different stages were increased by heat stress and gradually decreased with grain development under both high-temperature and control conditions. Gelatinization enthalpy increased initially but decreased after peaking at 22 DAP under both control and heat stress conditions. High temperature decreased gelatinization enthalpy after 10 DAP. Retrogradation percentage value increased with high temperature throughout grain development. Conclusion. High temperature after pollination changes the dynamics of grain filling of waxy maize, which may underlie the observed changes in its pasting and thermal properties
机译:背景。蜡质玉米生长在华南地区,那里经常盛行高温。高温胁迫对蜡质玉米籽粒发育的影响尚不清楚。结果。高温降低了授粉后22天(DAP)后谷物的鲜重和体积,降低了谷物的干重和水分含量。暴露于高温的植物成熟时淀粉含量低,蛋白质和可溶性糖含量高。在所有籽粒灌浆阶段,热胁迫都会增加淀粉碘的结合能力和颗粒尺寸。前一个参数随着谷物的发展而降低,而后一个参数则随着谷物的发展而逐渐增加。高温在30 DAP之前增加了峰值和击穿粘度,但在成熟时该值降低了。在高温和控制条件下,热应力使不同阶段的糊化和糊化温度升高,并随着晶粒的发展逐渐降低。在控制和热应激条件下,糊化焓最初都增加,但在22 DAP达到峰值后降低。 10 DAP后,高温降低了糊化焓。在整个晶粒发育过程中,回生百分比值随高温而增加。结论。授粉后的高温改变了蜡质玉米的籽粒填充动态,这可能是观察到的糊化和热特性变化的基础

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