首页> 外文期刊>Journal of the Optical Society of America, B. Optical Physics >Fabrication and direct transmission measurement of high-aspect-ratio two-dimensional silicon-based photonic crystal chips
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Fabrication and direct transmission measurement of high-aspect-ratio two-dimensional silicon-based photonic crystal chips

机译:高纵横比二维硅基光子晶体芯片的制作与直接透射测量

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We report the fabrication and characterization of two-dimensional silicon-based photonic crystal (PhC) structures realized by a combination of electron-beam lithography and dry-etching techniques. PhCs of various lattices with very high aspect ratios up to 20 have been achieved, and PhC chips were prepared by standard semiconductor technologies, including thinning and cleaving. The chips consisting of high-aspect-ratio air rods or dielectric rods permit a direct transmission measurement, and they were observed to demonstrate pronounced photonic bandgap effects. Several photonic bandgap behaviors were identified by comparing transmission with reflection and experimental results with numerical results, and by considering detecting beam property. (C) 2001 Optical Society of America. [References: 26]
机译:我们报告的制造和表征的二维硅基光子晶体(PhC)结构通过结合电子束光刻和干法蚀刻技术实现的。已经实现了具有高达20的高纵横比的各种晶格的PhC,并且通过标准的半导体技术(包括薄化和切割)制备了PhC芯片。由高纵横比空气棒或介电棒组成的芯片可以直接透射测量,并且观察到它们表现出明显的光子带隙效应。通过比较透射与反射以及实验结果与数值结果,并考虑检测光束特性,确定了几种光子带隙行为。 (C)2001年美国眼镜学会。 [参考:26]

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