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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Conductive-atomic force microscopy characterization of Ta_2O_5/SiO_2 stacks and the effect of microwave irradiation
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Conductive-atomic force microscopy characterization of Ta_2O_5/SiO_2 stacks and the effect of microwave irradiation

机译:Ta_2O_5 / SiO_2堆的导电原子力显微镜表征及微波辐射的影响

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The local electrical properties of ultrathin (4 nm) sputtered Ta_2O_5 on Si was studied by the conductive atomic force microscopy (C-AFM) technique. A current degradation during the repeatedly applied ramped voltages on the same dielectric point was observed, and the current increase was interpreted as stress-induced leakage current. With increasing applied voltages the impact of more leaky regions in the current map is stronger due to defect generation and the start of trapping/detrapping processes in these defects. Short exposure (seconds) to microwave irradiation acts as an annealing process of nanoscale level electrically active centres. The individual effect of both interfacial SiO_2-like and bulk Ta_2O_5 layers on the current-voltage (I-V) characteristics, and the difficulties in the data interpretation when using the known methods typical of macroscopic measurements were discussed. If the stack parameters used in the I-V curves fitting procedure are not known accurately the conclusion on the mechanism of conductivity is uncertain. Therefore, C-AFM as a novel characterization technique should be further developed to make it adequate for high-k stacks I-V data interpretation.
机译:通过导电原子力显微镜(C-AFM)技术研究了在Si上溅射超薄(4 nm)Ta_2O_5的局部电学性能。观察到在相同介电点上反复施加倾斜电压期间电流下降,并且该电流增加被解释为应力引起的泄漏电流。随着施加电压的增加,由于缺陷的产生以及在这些缺陷中的俘获/去俘获过程的开始,电流图中更多泄漏区域的影响更强。微波辐射的短时间(秒)是纳米级电活性中心的退火过程。讨论了界面SiO_2样和块状Ta_2O_5层对电流-电压(I-V)特性的单独影响,以及在使用典型的宏观测量方法进行数据解释时遇到的困难。如果在I-V曲线拟合过程中使用的堆栈参数未知,则电导率机理的结论尚不确定。因此,应进一步开发C-AFM作为一种新颖的表征技术,使其足以用于高k堆栈的I-V数据解释。

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