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首页> 外文期刊>Journal of Photopolymer Science and Technology >In-situ Measurement of Outgassing from Chemically Amplified Resist during Exposure to 248nm Light
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In-situ Measurement of Outgassing from Chemically Amplified Resist during Exposure to 248nm Light

机译:暴露于248nm光期间化学放大抗蚀剂除气的原位测量

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The outgas components from photoresists exposed to light sometimes form on the lenses and mirrors of aligners and are detrimental to their optical properties.This has recently become a major problem,and thus it is important to know the extent of outgassing from such resists when considering the effects of the outgas.We attached a QCM mass spectrometer to a 248 nm reaction analysis exposure tool equipped with a mercury-xenon (Hg-Xe) lamp light source and traced the change in the photoresist mass to investigate the amount of outgassing from a 248 nm chemically amplified photoresist during exposure.We collected the outgas generated from the resist during exposure in a TENAX absorber and identified the outgas components using a GC-MS.We also conducted an in-situ observation of the reaction in the photoresist using a PAGA-100 deprotection reaction analysis system and investigated the relationship between the outgas emission and the deprotection reaction.The results of these experiments are reported in this paper.
机译:光刻胶暴露在光线下的废气成分有时会形成在对准镜的透镜和反射镜上,这不利于它们的光学性能。这最近成为一个主要问题,因此,在考虑使用这种抗蚀剂时,了解此类抗蚀剂的除气程度非常重要。我们将QCM质谱仪连接到配备有汞-氙(Hg-Xe)灯光源的248 nm反应分析曝光工具上,并跟踪光致抗蚀剂质量的变化以研究248产生的脱气量nm在曝光过程中化学放大了光致抗蚀剂。我们在TENAX吸收器中收集了在曝光过程中抗蚀剂产生的废气,并使用GC-MS鉴定了废气成分。我们还使用PAGA-进行了光致抗蚀剂中的反应原位观察。 100脱保护反应分析系统,研究了废气排放与脱保护反应之间的关系。这些实验的结果是本文报道。

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