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首页> 外文期刊>Journal of Nuclear Materials: Materials Aspects of Fission and Fusion >Fracture behavior of high-strength, high-conductivity copper alloys
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Fracture behavior of high-strength, high-conductivity copper alloys

机译:高强度,高电导率铜合金的断裂行为

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摘要

The fracture behavior of three copper alloys, namely, one dispersion-strengthened alloy: GlidCop(TM)CuAl25, and two precipitation-hardened alloys: Hycon3HP(TM)CuNiBe and Elbrodur CuCrZr, was investigated in the temperature range 20-300 degreesC in vacuum. The results show that all these three alloys experienced a loss of fracture resistance with increasing test temperature. In the case of the CuNiBe alloy, the fracture resistance drops very rapidly as test temperature increases, and the other two alloys also experience drops in toughness, but not quite to the same extent. In fact, the fracture resistance of CuCrZr is affected only moderately by test temperature. The reduction of fracture resistance with increasing temperature in vacuum shows that the environment is not the only factor responsible for poor toughness. Further, microstructural analysis of the CuNiBe alloy shows that changes in grain boundary microstructure resulted from discontinuous precipitation. This is assumed to have a significant effect on the fracture behavior of this alloy. (C) 2000 Elsevier Science B.V. All rights reserved. [References: 4]
机译:在真空中在20-300摄氏度的温度范围内研究了三种铜合金的断裂行为,即一种弥散强化合金:GlidCop™CuAl25和两种沉淀硬化合金:Hycon3HP™CuNiBe和Elbrodur CuCrZr。 。结果表明,随着测试温度的升高,所有这三种合金都经历了抗断裂性的损失。对于CuNiBe合金,其断裂强度会随着测试温度的升高而迅速下降,而其他两种合金的韧性也会下降,但程度不尽相同。实际上,CuCrZr的抗断裂性仅受测试温度的影响。随着真空温度的升高,抗断裂性降低,这表明环境并不是造成韧性差的唯一因素。此外,对CuNiBe合金的显微组织分析表明,晶界显微组织的变化是由不连续的沉淀引起的。假定这对该合金的断裂行为具有重要影响。 (C)2000 Elsevier Science B.V.保留所有权利。 [参考:4]

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