...
首页> 外文期刊>Journal of Micromechanics and Microengineering >A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength
【24h】

A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength

机译:低尺寸损耗,高结合强度的PET平面纳米流体芯片的新型结合方法

获取原文
获取原文并翻译 | 示例

摘要

Plastic planar nanofluidic chips are becoming increasingly important for biological and chemical applications. However, the majority of the present bonding methods for planar nanofluidic chips suffer from high dimension loss and low bonding strength. In this work, a novel thermal bonding technique based on O-2 plasma and ethanol treatment was proposed. With the assistance of O-2 plasma and ethanol, the PET (polyethylene terephthalate) planar nanofluidic chip can be bonded at a low bonding temperature of 50 degrees C. To increase the bonding rate and bonding strength, the O-2 plasma parameters and thermal bonding parameters were optimized during the bonding process. The tensile test indicates that the bonding strength of the PET planar nanofluidic chip can reach 0.954 MPa, while the auto-fluorescence test demonstrates that there is no leakage or blockage in any of the bonded micro-or nanochannels.
机译:塑料平面纳米流体芯片对于生物和化学应用正变得越来越重要。然而,目前用于平面纳米流体芯片的大多数结合方法遭受高尺寸损失和低结合强度的困扰。在这项工作中,提出了一种基于O-2等离子体和乙醇处理的新型热粘合技术。借助O-2等离子体和乙醇,可以在50摄氏度的低粘合温度下粘合PET(聚对苯二甲酸乙二醇酯)平面纳米流体芯片。为了提高粘合速率和粘合强度,O-2等离子体参数和热在粘合过程中优化了粘合参数。拉伸测试表明,PET平面纳米流体芯片的粘合强度可以达到0.954 MPa,而自发荧光测试表明,在任何键合的微通道或纳米通道中都没有泄漏或阻塞。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号