...
首页> 外文期刊>Journal of Micromechanics and Microengineering >Elastomer microspring arrays for biomedical sensors fabricated using micromachined silicon molds
【24h】

Elastomer microspring arrays for biomedical sensors fabricated using micromachined silicon molds

机译:使用微加工硅模具制造的用于生物医学传感器的弹性体微弹簧阵列

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

An approach to the implementation of micromachined structures in silicon suitable for use in the molding of large area elastomer microspring arrays is presented. Such arrays are of interest as primary sensing elements in the development of improved biomedical interface pressure sensors having low profile but with relatively large area so as to reduce interface measurement artifacts. The approach exploits the special features of anisotropically etched silicon to generate molds which are then used to form elastomer microspring array structures with individual array element shapes designed to optimize spring mechanical performance parameters. The basic shape used is a trench of trapezoidal cross section with depth in the range 5-40 mum, and length which may extend close to the edges of the die, i.e. 9.5 mm long. The molding process produces complementary elastomer structures with corresponding precision to that of the molds. Preliminary, stress-strain results for the arrays are inconsistent with simple elastic theory. However, it is found that a straightforward interpretation of the data is possible using the elastic theory for large deflections by incorporating an empirical shape factor adjustment. Experimentally determined Young's moduli ranged from 300 kPa to 560 kPa for the microspring arrays tested. This approach offers the potential to match and optimize elastomer microspring array mechanical properties to specific biomedical interface sensor requirements. [References: 21]
机译:提出了一种在硅中实现微机械结构的方法,该方法适用于模制大面积弹性体微弹簧阵列。在改进的生物医学界面压力传感器的开发中,这种阵列作为主要的感测元件是有意义的,该传感器具有低轮廓但具有相对大的面积,以减少界面测量伪影。该方法利用各向异性蚀刻的硅的特殊功能来生成模具,然后将其用于形成弹性体微弹簧阵列结构,该阵列结构具有旨在优化弹簧机械性能参数的单个阵列元件形状。所使用的基本形状是梯形横截面的沟槽,其深度在5-40μm的范围内,并且其长度可以靠近模具的边缘延伸,即9.5mm长。模制过程可产生与模具精度相对应的互补弹性体结构。阵列的初步应力-应变结果与简单的弹性理论不一致。但是,发现通过结合经验形状因子调整,可以使用弹性理论对大挠度进行数据的直接解释。实验测得的微弹簧阵列的杨氏模量范围为300 kPa至560 kPa。这种方法提供了匹配和优化弹性体微弹簧阵列机械性能以满足特定生物医学界面传感器要求的潜力。 [参考:21]

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号