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Etching and hydrogen diffusion mechanisms during a hydrogen plasma treatment of silicon thin films

机译:硅薄膜氢等离子体处理过程中的腐蚀和氢扩散机理

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摘要

We present here an in situ spectroscopic ellipsometry (SE) study of hydrogen diffusion through hydrogenated amorphous silicon, when exposed to a hydrogen plasma. The spectroscopic data were analyzed by a combination of the tetrahedron model and the Bruggemann effective medium approximation, Our results indicate that etching of amorphous silicon is not just a surface process. Indeed. the formation of a rather thick sub-surface layer appears as a necessary condition for etching. The hydrogen content and thickness of the sub-surface layer were also confirmed by secondary ion mass spectrometry (SIMS) measurements. These results are discussed with respect to the nucleation process of microcrystalline silicon films. (C) 2002 Elsevier Science B.V. All rights reserved. [References: 12]
机译:我们在这里介绍了当暴露于氢等离子体时氢通过氢化非晶硅扩散的原位光谱椭偏(SE)研究。通过四面体模型和Bruggemann有效介质近似的组合分析光谱数据,我们的结果表明,刻蚀非晶硅不仅仅是表面过程。确实。形成相当厚的次表面层似乎是蚀刻的必要条件。还通过二次离子质谱(SIMS)测量来确认表面下层的氢含量和厚度。关于微晶硅膜的成核过程讨论了这些结果。 (C)2002 Elsevier Science B.V.保留所有权利。 [参考:12]

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