Evaluation of epoxy underfill materials for solder flip-chip technology

摘要

Solder flip-chip technology is increasingly viewed as an attractive alternative for packaging/interconnection of ICs in a broad range of microelectronic applications. The technology offers high I/O interconnection in a small footprint with good thermal performance and a short chip-to-chip interconnection length. Whereas in the past the technology has been used typically in high performance computing devices, more recently the consumer electronics industry is beginning to take advantage of this cost effective "chip-on-board" method of interconnection [1,2]. The demand for an inexpensive, reliable chip packaging technology is leading industry to adapt more direct chip attachment in the manufacture of system or subsystem assemblies. Moreover, the ever increasing demand to miniaturize components, especially in portable electronic devices, makes the flip-chip option more attractive. Flip-chip technology also represents a potentially less expensive interconnection/assembly process compared to conventional wire bonding, particularly in the case of high I/O devices because of its rapid assembly capability [1,2].