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Preferred growth of epitaxial TiN thin film on silicon substrate by pulsed laser deposition

机译:通过脉冲激光沉积在硅衬底上优先生长外延TiN薄膜

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摘要

Epitaxial TiN thin films on silicon substrates were prepared by pulsed excimer laser (KrF, 34 ns) ablation of a hot-pressed TiN target in nitrogen gas atmosphere. X-ray diffraction (XRD) showed that the preferred orientations of TiN thin films did not change with substrate temperatures, nitrogen gas pressure and film thickness; however, they did change with the orientations of substrates. The epitaxial orientation relationships between high-quality epitaxial TiN thin films and silicon substrates [242] TiN parallel to [242] Si, (111) TiN parallel to( 111) Si and [311] TiN parallel to [311] Si, (100) TiN parallel to(100) Si. The full-width at half-maximum (FWHM) of the rocking curve of XRD and the minimum channelling yield of Rutherford backscattered spectroscopy (RBS) of the epitaxial TiN thin film were estimated to be 0.3 degrees and 7.3%, respectively, indicating excellent crystalline quality of the grown film. X-ray photoelectron spectroscopy confirmed that the binding energies of Ti2p3/2 and N1s core levels in epitaxial thin film were 455.2 and 397.1 eV, respectively, corresponding to those of TiN bulk. By calibrating the RBS spectra, the chemical composition of TiN thin films was found to be titanium-rich. The typical surface roughness of TiN thin film observed by scanning probe microscopy was about 1.5 nm. (C) 1998 Chapman & Hall. [References: 10]
机译:通过在氮气气氛中对热压TiN靶材进行脉冲准分子激光(KrF,34 ns)烧蚀制备硅衬底上的外延TiN薄膜。 X射线衍射(XRD)表明,TiN薄膜的择优取向不随衬底温度,氮气压力和膜厚的变化而变化。但是,它们的确随基材的方向而变化。高质量外延TiN薄膜与硅衬底之间的外延取向关系[242] TiN平行于[242] Si,(111)TiN平行于(111)Si,[311] TiN平行于[311] Si,(100 TiN平行于(100)Si。外延TiN薄膜的XRD摇摆曲线的半峰全宽(FWHM)和卢瑟福背散射光谱(RBS)的最小通道化产率分别估计为0.3度和7.3%,表明具有出色的结晶性电影的质量。 X射线光电子能谱证实,外延薄膜中Ti2p3 / 2和N1s核心能级的结合能分别为455.2和397.1 eV,与TiN体的能级相对应。通过校准RBS光谱,发现TiN薄膜的化学成分富含钛。通过扫描探针显微镜观察到的TiN薄膜的典型表面粗糙度为约1.5nm。 (C)1998查普曼和霍尔。 [参考:10]

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