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首页> 外文期刊>Journal of Materials Processing Technology >Characteristics of mask layer on (100) silicon induced by tribo-nanolithography with diamond tip cantilevers based on AFM
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Characteristics of mask layer on (100) silicon induced by tribo-nanolithography with diamond tip cantilevers based on AFM

机译:基于原子力显微镜的金刚石尖端悬臂摩擦纳米光刻在(100)硅上形成掩膜层的特性

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摘要

Nanoscale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) followed by chemical etching was demonstrated. A specially designed cantilever with a diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin damaged layer forms in the substrate at the diamond tip - sample junction along scanning path of the tip, which was found to be a low crystallized amorphous silicon layer. Hence, these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D microstructures in nanometer range. Diamond tip fabrication processes for TNL follow the micro-patterning, wet chemical etching and CVD based on MEMS processes. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano-machining tool. In our previous work, is has been clearly known that the damaged layer withstands against aqueous potassium hydroxide solution, while it dissolves in diluted hydro fluoric solution. This study demonstrates the effect of various machining parameters on mask layer, followed by wet chemical etching in potassium hydroxide and hydro fluoric solution.
机译:证明了基于使用原子力显微镜(AFM)进行化学刻蚀的硅基板的纳米级制造。一种特殊设计的带有菱形尖端的悬臂可以代替传统的硅悬臂进行扫描,该悬臂可以通过简单的刮擦工艺在硅基板上形成受损层。沿尖端的扫描路径在金刚石尖端-样品结处的基底中形成薄的受损层,发现该层是低结晶的非晶硅层。因此,这些被称为摩擦纳米光刻技术(TNL)的顺序过程可以制造纳米范围内的2D或3D微结构。 TNL的金刚石尖端制造工艺遵循基于MEMS工艺的微图案,湿法化学蚀刻和CVD。已开发的TNL工具对单晶硅晶片表现出出色的可加工性。因此,期望它们有可能作为微纳米加工工具在工业上应用。在我们以前的工作中,已经清楚地知道,受损层在溶解于稀释的氢氟酸溶液中时,能够抵抗氢氧化钾水溶液的侵蚀。这项研究证明了各种加工参数对掩模层的影响,然后在氢氧化钾和氢氟酸溶液中进行湿法化学蚀刻。

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