首页> 外文期刊>Journal of Materials Processing Technology >Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes
【24h】

Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes

机译:研磨和研磨过程中光学材料的表面损伤与表面粗糙度之间的关系

获取原文
获取原文并翻译 | 示例
           

摘要

Subsurface damage generated in manufacturing processes directly influences performances of optical elements, however, the rapid inspection of subsurface damage is unresolved for it is covered under surface. For the purpose of rapid, accurate, and non-destructive measurement of subsurface damage produced in optical grinding and lapping processes, a theoretical model of relationship between subsurface damage and surface roughness was established through investigating median and lateral crack system in brittle surface induced by sharp indenter, and contribution of elastic stress field to the median crack propagation was also considered in the loading cycle. With this model, subsurface damage depth can be predicted accurately via measuring surface roughness of manufactured optical elements. The subsurface damage depth and surface roughness of ground and lapped BK7 glass were measured by MRF (magnetorheological finishing) spot technique and contacting profilometer, respectively, in order to verify the validity of the relationship model. The results show that the relationship model is convenient and accurate in predicting the subsurface damage depth. And there exists monotone increasing non-linear correlation between subsurface damage depth and surface roughness (p - v value) in optical grinding and lapping processes. At last the relationship between subsurface damage depth and process conditions in grinding and lapping processes and material mechanical properties is discussed.
机译:在制造过程中产生的表面下损坏直接影响光学元件的性能,但是,由于表面下覆盖了表面下的损坏,因此无法快速检查表面下的损坏。为了快速,准确,无损地测量光学研磨和研磨过程中产生的亚表面损伤,通过研究尖锐化引起的脆性表面的中值和横向裂纹系统,建立了亚表面损伤与表面粗糙度之间关系的理论模型。在加载周期中,还考虑了压头和弹性应力场对中值裂纹扩展的贡献。使用此模型,可以通过测量制造的光学元件的表面粗糙度来准确预测地下损伤深度。通过MRF(磁流变精加工)点技术和接触轮廓仪分别测量了研磨的和研磨的BK7玻璃的亚表面损伤深度和表面粗糙度,以验证该关系模型的有效性。结果表明,该关系模型可以方便,准确地预测地下破坏深度。在光学研磨和研磨过程中,表面损伤深度和表面粗糙度(p-v值)之间存在单调增加的非线性关系。最后讨论了磨削和精研过程中地下损伤深度与工艺条件之间的关系以及材料的机械性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号