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首页> 外文期刊>Journal of Geophysical Research, A. Space Physics: JGR >The relation between coronal holes and coronal mass ejections during the rise, maximum, and declining phases of Solar Cycle 23
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The relation between coronal holes and coronal mass ejections during the rise, maximum, and declining phases of Solar Cycle 23

机译:太阳周期23的上升,最大和下降阶段中日冕孔与日冕物质弹射之间的关系

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We study the interaction between coronal holes (CHs) and coronal mass ejections (CMEs) using a resultant force exerted by all the coronal holes present on the disk and is defined as the coronal hole influence parameter (CHIP). The CHIP magnitude for each CH depends on the CH area, the distance between the CH centroid and the eruption region, and the average magnetic field within the CH at the photospheric level. The CHIP direction for each CH points from the CH centroid to the eruption region. We focus on Solar Cycle 23 CMEs originating from the disk center of the Sun (central meridian distance ≤ 15°) and resulting in magnetic clouds (MCs) and non-MCs in the solar wind. The CHIP is found to be the smallest during the rise phase for MCs and non-MCs. The maximum phase has the largest CHIP value (2.9 G) for non-MCs. The CHIP is the largest (5.8 G) for driverless (DL) shocks, which are shocks at 1 AU with no discernible MC or non-MC. These results suggest that the behavior of non-MCs is similar to that of the DL shocks and different from that of MCs. In other words, the CHs may deflect the CMEs away from the Sun-Earth line and force them to behave like limb CMEs with DL shocks. This finding supports the idea that all CMEs may be flux ropes if viewed from an appropriate vantage point.
机译:我们使用存在于磁盘上所有冠状孔的合力研究冠状孔(CHs)与冠状物质抛射(CME)之间的相互作用,并定义为冠状孔影响参数(CHIP)。每个CH的CHIP大小取决于CH区域,CH质心与喷发区域之间的距离以及CH内光球水平的平均磁场。每个CH的CHIP方向从CH质心指向喷发区域。我们专注于太阳周期23 CME,它们起源于太阳的圆盘中心(中心子午距离≤15°),并在太阳风中产生磁云(MC)和非MC。对于MC和非MC,发现CHIP在上升阶段最小。对于非MC,最大相位具有最大的CHIP值(2.9 G)。对于无人驾驶(DL)电击,CHIP是最大的(5.8 G)电击,这是1 AU的电击,没有可识别的MC或非MC。这些结果表明,非MC的行为类似于DL冲击,并且不同于MC。换句话说,CH可能会使CME偏离太阳地球线,并迫使它们表现为具有DL冲击的肢体CME。这一发现支持这样一个想法,即从适当的有利位置来看,所有CME可能都是助焊剂。

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