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Electronic Thermal Properties of the Interface between a Normal Metal and a High-Temperature Superconducting Material

机译:普通金属与高温超导材料之间界面的电子热学性质

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摘要

The electron thermal flux and electron thermal conductivity of the interface between a normal metal and a high-temperature superconductor (HTSC) are calculated using quasiclassical equations. Calculations are made for various values of the interface transparency and various orientations of the axes of a HTSC crystal. It was shown that compared with an interface between a normal metal and an "ordinary" superconductor (s-type symmetry, isotropic order parameter), the thermal conductivity of an HTSC-normal-metal interface is substantially higher and has a nonactivation dependence. The thermal properties were calculated for various interface models, including mirror and diffuse, and also for various potential barrier profiles. An analysis is made of the possibility of using devices based on normal-metal-HTSC interfaces for bolometric and microrefrigerator applications.
机译:使用准经典方程式计算正常金属与高温超导体(HTSC)之间的界面的电子热通量和电子热导率。针对界面透明性的各种值和HTSC晶体的轴的各种方向进行计算。结果表明,与普通金属和“普通”超导体之间的界面(s型对称性,各向同性有序参数)相比,HTSC-普通金属界面的导热系数明显更高,并且具有非活化依赖性。针对各种界面模型(包括反射镜和漫反射)以及各种势垒分布,计算了热性能。分析了在辐射热和微制冷机应用中使用基于普通金属HTSC接口的设备的可能性。

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