首页> 外文期刊>Journal of Electronic Materials >Processing and Thermoelectric Performance Characterization of Thin-Film Devices Consisting of Electrodeposited Bismuth Telluride and Antimony Telluride Thin-Film Legs
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Processing and Thermoelectric Performance Characterization of Thin-Film Devices Consisting of Electrodeposited Bismuth Telluride and Antimony Telluride Thin-Film Legs

机译:电沉积碲化铋和碲化锑薄膜腿组成的薄膜器件的加工和热电性能表征

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摘要

Thermopile thin-film devices were fabricated by successive electrodeposition of p-type Sb-Te and n-type Bi-Te films. The thermopile processed with 1-(mu)m-thick SiO_(2) as an insulating layer on the thin-film legs exhibited sensitivity of 57.5 mV/K, much larger than the 7.3 mV/K measured for a thermopile with an insulating layer of 6-(mu)m-thick photoresist. Sensitivity of 30.4 mV/K was obtained for a thermopile with a 1-(mu)m-thick SiN_(x) insulating layer.
机译:通过连续电沉积p型Sb-Te和n型Bi-Te膜来制造热电堆薄膜器件。用1-μm厚的SiO_(2)作为薄膜腿上的绝缘层处理的热电堆的灵敏度为57.5 mV / K,远大于带绝缘层的热电堆测得的7.3 mV / K。 6μm厚的光刻胶。对于具有1μm厚的SiN_(x)绝缘层的热电堆,其灵敏度为30.4 mV / K。

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