首页> 外文期刊>Journal of Electronic Materials >Acceptor and Donor Doping of AI↓(x)Ga↓(1- x)N Thin Film Alloys Grown on 6H-SiC(0001) Substrates via Metalorganic Vapor Phase Epitaxy
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Acceptor and Donor Doping of AI↓(x)Ga↓(1- x)N Thin Film Alloys Grown on 6H-SiC(0001) Substrates via Metalorganic Vapor Phase Epitaxy

机译:通过金属有机气相外延生长在6H-SiC(0001)衬底上的AI↓(x)Ga↓(1-x)N薄膜合金的受主和施主掺杂

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摘要

Thin films of Si-doped Al↓(Χ)Ga↓(1-Χ)N (0.03≤ x ≤ 0.58) having smooth surfaces and strong near-band edge cathodoluminescence were deposited at 0.35-0.5μm/h on on-axis 6H-SiC(0001) substrates at 1100℃using a 0.1 μm A1N buffer layer for electrical isolation. Alloy films having the compositions of A1↓(0.08)Ga↓(0.92)N and A1↓(0.48)Ga↓(0.52)N exhibited mobilities of 110 and 14 cm↑(2)/V.s at carrier concentrations of 9.6 × 10↑(18) and 5.0 × 10↑(17)cm↑(-3), respectively. This marked change was due primarily to charge scattering as a result of the increasing Al concentration in these random alloys. Comparably doped GaN films grown under similar conditions had mobilities between 170 and -350 cm↑(2)/V.s. Acceptor doping of Al↓(Χ)Ga↓(1-Χ)N for x ≤ 0.13 was achieved for films deposited at 1100℃. No correlation between the O concentration and p-type electrical behavior was observed.
机译:在轴6H上以0.35-0.5μm/ h的速度沉积具有表面光滑且近带边缘阴极荧光强的Si掺杂的Al↓(Χ)Ga↓(1-Χ)N(0.03≤x≤0.58)薄膜-SiC(0001)衬底,在1100℃下使用0.1μm的AlN缓冲层进行电隔离。组成为A1↓(0.08)Ga↓(0.92)N和A1↓(0.48)Ga↓(0.52)N的合金膜在载流子浓度为9.6×10↑时表现出110和14 cm↑(2)/ Vs的迁移率。 (18)和5.0×10↑(17)cm↑(-3)。这种明显的变化主要是由于这些无规合金中Al浓度的增加导致电荷散射所致。在相似条件下生长的掺杂GaN薄膜的迁移率在170和-350 cm↑(2)/V.s之间。对于在1100℃下沉积的膜,实现了x≤0.13的Al↓(Χ)Ga↓(1-Χ)N的受体掺杂。没有观察到O浓度和p型电行为之间的相关性。

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