Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications

摘要

There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing.In this paper,several anisotropic conductive adhesive (ACA) pastes were formulated,which consist of diglycidyl ether of bisphenol F or diglycidyl ether of bisphenol A as polymer matrix,imidazoles as curing agents,and different sizes of silver (Ag) powders or gold (Au)-coated polymer spheres as conductive particles.The effects of ACA resin and different curing agents,as well as different conductive particles,on flexible substrate of the flip-chip joint were studied.The results show that the size and type of different conductive particles have very limited influence on an ACA flip-chip joint.The ACA resin as well as the curing agent can affect the reliability of the joint.The same results can be applied for the failure analysis of ACA flip-chip technology.