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首页> 外文期刊>Journal of Electronic Materials >A CdTe Passivation Process for Long Wavelength Infrared HgCdTe Photo-Detectors
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A CdTe Passivation Process for Long Wavelength Infrared HgCdTe Photo-Detectors

机译:长波长红外HgCdTe光检测器的CdTe钝化工艺

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Passivant-Hg_(1-x)Zn_xTe interface has been studied for the CdTe and anodic oxide(AO)passivants.The former passivation process yields five times lower surface recombination velocity than the latter process.Temperature dependence of surface recombination velocity of the CdTe-HgCdTe and AO-HgCdTe interface is analyzed.Activation energy of the surface traps for CdTe and AO-passivated wafers are estimated to be in the range of 7-10 meV.These levels are understood to be arising from Hg vacancies at the HgCdTe surface.Fixed charge density for CdTe-HgCdTe interface measured by CV technique is 5 X 10~(10)cm~(-2),which is comparable to the epitaxially grown CdTe films.An order of magnitude improvement in responsivity and a factor of 4 increase in specific detectivity(D*)is achieved by CdTe passivation over AO passivation.This study has been conducted on photoconductive detectors to qualify the CdTe passivation process,with an ultimate aim to use it for the passivation of p-on-n and n-on-p HgCdTe photodiodes.
机译:研究了CdTe和阳极氧化物(AO)钝化剂的钝化剂-Hg_(1-x)Zn_xTe界面。前者的钝化过程产生的表面复合速度比后者钝化过程低五倍。分析了n-HgCdTe和AO / n-HgCdTe界面.CdTe和AO钝化晶片的表面陷阱的活化能估计在7-10 meV的范围内,这些水平被认为是由于汞空位引起的通过CV技术测得的CdTe / n-HgCdTe界面的固定电荷密度为5 X 10〜(10)cm〜(-2),与外延生长的CdTe薄膜相当。响应度提高了一个数量级。 CdTe钝化比AO钝化可将比检测率(D *)提高4倍。这项研究是在光电导检测器上进行的,以验证CdTe钝化的过程,其最终目的是将其用于p-钝化。在n和n-on-p HgCdTe光电二极管。

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