Optimization of a Common Buffer Platform for Monolithic Integration of InGaN/GaN Light-Emitting Diodes and AlGaN/GaN High-Electron-Mobility Transistors

摘要

For the development of a metal-interconnection-free integration scheme for monolithic integration of InGaN/GaN light-emitting diodes (LEDs) and AlGaN/GaN high-electron-mobility transistors (HEMTs), a common buffer to achieve high brightness, low leakage current, and high breakdown in the integrated HEMT-LED device is essential. Different buffer structures have been investigated, and their impacts upon both the LED and HEMT parts of the HEMT-LED device have been analyzed. Results indicated that a GaN/AlN buffer structure is the most ideal to serve as a common buffer platform, offering both the excellent crystalline quality and superior buffer resistivity required by the HEMT-LED device. Growth of the AlN layer was particularly crucial for engineering the dislocation density, surface morphology, as well as resistivity of the buffer layer. Using the optimized GaN/AlN buffer structure, the LED part of the HEMT-LED device was improved, showing greatly enhanced light output power and suppressed reverse leakage current, while the breakdown characteristics of the HEMT part were also improved.