Thermoelastic properties of plain weave composites for multilayer circuit board applications

摘要

The thermoelastic properties of woven glass/epoxy substrates for multilayer circuit board applications were investigated and the influence of fabric geometry assessed. The woven fabric geometry of several commercially pressed boards was carefullycharacterized using optical microscopy. The elastic moduli and Poisson's ratios were then measured in uniaxial tension, while the CTEs of the boards were measured using thermal mechanical analysis (TMA) at temperatures above and below the glasstransition. Experimental data were compared to predictions from two new analytical models. One of the models, which does not use classical lamination theory, results in a significant improvement for the prediction of Poisson's ratio and CTEs. Finally, aparametric study was performed to demonstrate the effect of fiber crimp on the properties of the fabric.