MULTILAYER BOARD APPLICATION TO RF CIRCUITRY

摘要

Investigation of miniaturization techniques suitable for a quick reaction facility has been continued, and techniques developed during previous R&D programs have been improved. Applications of miniaturization techniques to linear circuits in the very high and ultra high frequency ranges have been made successfully. Extensive use of multiple-layer, printed wiring boards has been made to maintain and update the state of the art in the laboratory. These boards have been designed to fit into extrusions to give support and isolation to the circuit. Performance data are included in this report, with an analysis of the major components of the designs.