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首页> 外文期刊>Journal of Electronic Materials >An elastoplastic beam model for column-grid-array solder interconnects
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An elastoplastic beam model for column-grid-array solder interconnects

机译:柱栅阵列焊料互连的弹塑性梁模型

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摘要

An analytical model is developed and implemented to analyze the deformation of solder columns in column-grid-array (CGA) assemblies. Each solder column is modeled as a prismatic beam of circular cross section subjected to end shearing deflectionscaused by thermal mismatch between the module and the circuit board. The solder is idealized as an elastic-perfectly plastic material whose yielding is governed by the von Mises criterion. Since the columns are relatively short by beam standards,transverse shear deformation has been incorporated into the beam model. The results generated with the model indicate the following:1 Yielding is governed by bending for slenderness ratios (height-to-diameter) of h/d≥1/square root of 3.2 The nonlinear stiffness relationship for a sheared column, presented in dimensionless form, reduces to a single curve, which is valid for arbitrary values of slenderness ratio (≥1/square root of 3) and material parameters.3 The normalized relationship between maximum shear strain (in the Tresca sense) and the relative end deflection depends on Poisson's ratio but is independent of the other material parameters and the slenderness ratio. The peak shear strain can easily bedecomposed into elastic and plastic portions.4 The maximum value of the total or the plastic shear strain in the solder column can be expressed in terms of a correction factor to be applied to the nominal shear strain (shear displacement divided by the column height). The correction factors arequite sensitive to the column slenderness and the load level. Since correction factors less than unity are possible, one should not interpret the nominal shear strain as the "average" shear strain in the column. Regardless of the load level, the nominalstrain underestimates the peak strain by the greatest amount at a slenderness ratio (height/diameter) of 1.7.The nonlinear stiffness results presented in the paper may be used to create more efficient finite element models of entire assemblies by replacing each column with a single nonlinear spring element. When used in conjunction with an appropriateCoffin-Manson relationship, the maximum shear strain results presented herein may be utilized to increase column fatigue life.
机译:开发并实施了一种分析模型,以分析列栅阵列(CGA)组件中焊锡柱的变形。每个焊料柱均建模为圆形横截面的棱柱形梁,其受到模块和电路板之间的热失配所导致的末端剪切变形的影响。焊料被理想化为一种弹性完美的塑料材料,其屈服度由冯·米塞斯(von Mises)准则控制。由于按梁标准,这些柱相对较短,因此已将横剪变形纳入了梁模型。该模型产生的结果表明:1屈服度由弯曲控制,h /d≥1/平方根的长细比(高/直径)3.2剪切柱的非线性刚度关系,以无量纲形式表示,减小为一条曲线,该曲线对于细长比(≥1的平方根)和材料参数有效。3最大剪切应变(在Tresca意义上)与相对端部挠度之间的规范化关系取决于泊松比但与其他材料参数和细长比无关。峰值剪切应变很容易分解成弹性部分和塑性部分。4焊锡柱中总剪切应变或塑性剪切应变的最大值可以用校正因子表示,该校正因子适用于名义剪切应变(剪切位移除以按列高)。校正因子对色谱柱的细长度和负载水平非常敏感。由于校正因子可能小于1,因此不应将名义剪切应变解释为柱中的“平均”剪切应变。无论负载水平如何,标称应变都会在1.7的细长比(高度/直径)下最大程度地低估峰值应变。用单个非线性弹簧元件替换每列。当与适当的棺材-曼森关系结合使用时,本文介绍的最大剪切应变结果可用于增加柱疲劳寿命。

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