High-Porosity Bamboo Charcoal for Silicon Wafer Polishing

摘要

This study proposes a new polishing approach which combines the use of high-porosity bamboo charcoal as the polishing tool and a slurry comprising high-hardness and high-wearability diamond powder as abrasives. The unique abrasive mechanism of bamboo charcoal is attributed its porous structure characterized by abundant vascular bundles, serving as channels for transport of diamond slurry suspension, thus ensuring good circulation of slurry; as well as by numerous carbonized parenchyma cells, forming pores and pits for retention of abrasive particles and chipped bamboo fragments. Its polishing efficiency is evidenced by an almost 90% enhancement in surface quality achieved by machining time, 30 min; rotational speed of spindle, 7.5 m/min; loading, 30 N; and particle size of abrasive, 1 mu m. The experimental results demonstrate the feasibility of using bamboo charcoal as an effective polishing tool.