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Helium effusion measurements for studying the microstructure of a-SiC:H films deposited by d.c.sputtering

机译:氦气渗出测量以研究通过直流溅射沉积的a-SiC:H薄膜的微观结构

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The effusion of helium was used for microstructure characterisation of d.c.sputtered amorphous silicon carbon (a-SiC:H) alloys.The results show that up to carbon concentrations of approximately 25 at.%,helium effuses mainly in two stages:a lower temperature effusion peak near 500 deg C is attributed to the out-diffusion of He from network sites while higher temperature He effusion is attributed to the release of He precipitated in isolated voids present from the deposition process.At carbon concentrations exceeding 25 at.%,helium is found to effuse predominantly in a single stage at lower temperature indicating the presence of interconnected voids.The results are in agreement with effusion results of implanted neon,argon as well as hydrogen.
机译:氦气的渗流被用于直流溅射非晶硅碳(a-SiC:H)合金的微观结构表征。结果表明,高达约25 at。%的碳浓度,氦气主要分两个阶段流出:较低温度的渗流500℃附近的峰值归因于He从网络位点向外扩散,而高温He渗出归因于沉积过程中存在的孤立空隙中沉淀的He的释放。碳浓度超过25 at。%时,氦为发现在较低的温度下主要在单个阶段中散发,表明存在互连的空隙。结果与注入的氖气,氩气和氢气的渗出结果一致。

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