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Fast removal of surface damage layer from single crystal diamond by using chemical etching in molten KCl plus KOH solution

机译:通过在熔融的KCl和KOH溶液中进行化学蚀刻,快速去除单晶金刚石的表面损伤层

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To fast remove the surface damage layer from single-crystal-diamond, we have developed a chemical etching process using molten KCl and KOH solution at high temperature around 1100 degrees C. High removal rate about R-{001} = 2.0 mu m/h, R-{101} = 20 mu m/h and R-{111} = 26 mu m/h was achieved for the {001} sample surfaces, {101} and 011 sample edges, respectively. Laser microscope observation has confirmed that the {001} surface flatness has been greatly improved after etching and surface roughness formed during previous lift-off process has been effectively removed. (C) 2015 Elsevier B.V. All rights reserved.
机译:为了快速去除单晶金刚石的表面损伤层,我们开发了一种化学蚀刻工艺,该工艺使用熔融的KCl和KOH溶液在1100摄氏度左右的高温下进行。高去除率约为R- {001} = 2.0μm / h ,对于{001}样品表面,{101}和011样品边缘,分别达到R- {101} =20μm/ h和R- {111} =26μm/ h。激光显微镜观察已经证实,{001}表面平整度在蚀刻之后已经得到很大改善,并且在先前剥离工艺期间形成的表面粗糙度已经被有效地去除。 (C)2015 Elsevier B.V.保留所有权利。

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