MOEMS: Technology, packaging and optical interconnection technology

摘要

The technological developments in the datacom and telecom areas increasingly overlap and intersect in the point of the MOEMS. This development is a highly dynamic one: academic and institutional research institutes all over the world are carrying out their MOEMS-related studies within the wider field of MEMS, and companies have begun to introduce reliable products. These include mainly mirrors and mirror arrays and fibre-optical switches for routing systems in optical networks, projection systems, light modulators and optically detecting sensors. The use of new materials and correspondingly adapted technologies/packaging solutions is an important factor in the acceleration of the development process. This article briefly introduced the memo-derived technologies and outlined the special requirements to the packaging and optical interconnection technologies. In the areas of packaging and optical launching particularly, standardized solutions will need to be developed in order to reduce the development costs.