Metrology and Data for Microelectronic Packaging and Interconnection: Results ofa Joint Workshop on Materials Metrology and Data for Commercial Electrical and Optical Packaging and Interconnection Technologies. Held in Gaithersburg, Maryland on May 5-6, 1

摘要

This NISTIR documents the results of a joint Industry - University - Governmentworkshop on 'Materials Metrology and Data for Commercial Electrical and Optical Packaging and Interconnection Technologies' conducted on May 5-6, 1994 at the Hilton Hotel in Gaithersburg, MD and was cosponsored by the National Institute of Standards and Technology, the Institute for Interconnecting and Packaging Electronic Circuits, the Optoelectronics Industry Development Association, and the Semiconductor Research Corporation. The workshop consisted of eight separate working groups. Four technology-focused working groups met to address the challenges and priorities in materials measurement and data to support the design, manufacture, and reliability assessment of critical electrical and optical packaging and interconnection materials, structures, and processes. Four performance-focused working groups also met to address the status, challenges, and gaps in metrology and data to describe the properties of materials utilized in the critical packaging and interconnection materials, structures, and processes identified earlier.