Metrology and Data for Microelectronic Packaging and Interconnection: Results ofa Joint Workshop on Materials Metrology and Data for Commercial Electrical and Optical Packaging and Interconnection Technologies. Held in Gaithersburg, Maryland on May 5-6, 1

摘要

This volume 2 consists of Appendix C, which contains presentations byrepresentatives from Motorola, GTE Laboratories, Cornell University, SRC, IPC, ARPA, ITRI, and the National Institute of Standards and Technology (NIST).