NEW PACKAGING TECHNOLOGIES AND BF (BARE-FIBER) OPTICAL CONNECTOR DEVELOPED FOR PARABIT (PARALLEL INTER-BOARD OPTICAL INTERCONNECTION TECHNOLOGY)MODULES

摘要

For future high-throughput switching systems, a parallel inter-board optical interconnection technology (ParaBIT) with a throughput of 28Gbit/s (700Mbit/s x40ch) has been developed. Some key technologies for its front-end module include:(1) multi-channel optical coupling using a polymeric optical waveguide film with 45deg mirrors at its edge for 90 deg optical path deflection,(2) TMB(Transferred Multichip Bonding) for precise mounting of optical device chips, and (3) a multi-port BF(Bare Fiber) optical connector for the optical interface of the ParaBITmodule.