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首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Chemical structure and electrical properties of sputtered HfO2 films on Si substrates annealed by rapid thermal annealing
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Chemical structure and electrical properties of sputtered HfO2 films on Si substrates annealed by rapid thermal annealing

机译:快速热退火退火Si衬底上溅射HfO2薄膜的化学结构和电性能

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摘要

The chemical structure and electrical properties of HfO2 thin film grown by rf reactive magnetron sputtering after rapid thermal annealing (RTA) were investigated. The chemical composition of HfO2 films and interfacial chemical structure of HfO2/Si in relation to the RTA process were examined by X-ray photoelectron spectroscopy. Hf 4f and O 1s core level spectra suggest that the as-deposited HfO2 film is nonstoichiometric and the peaks shift towards lower binding energy after RTA. The Hf-Si bonds at the HfO2/Si interface can be broken after RTA to form Hf-Si-O bonds. The electrical characteristics of HfO2 films were determined by capacitance-voltage (C-V) and current density-voltage (J-V) measurements. The results showed that the density of fixed charge and leakage current density of HfO2 film were decreased after the RTA process in N-2 atmosphere.
机译:研究了通过射频反应磁控溅射快速热退火(RTA)后生长的HfO2薄膜的化学结构和电学性质。用X射线光电子能谱研究了HtO2膜的化学组成和HtO2 / Si的界面化学结构与RTA的关系。 Hf 4f和O 1s核心能级谱表明,沉积的HfO2膜是非化学计量的,并且在RTA之后峰向较低的结合能移动。在RTA之后,HfO2 / Si界面处的Hf-Si键可以断裂形成Hf-Si-O键。 HfO2薄膜的电特性通过电容-电压(C-V)和电流密度-电压(J-V)测量来确定。结果表明,在N-2气氛下进行RTA处理后,HfO2膜的固定电荷密度和漏电流密度降低。

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