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A Novel Surface Finishing Technique for Microparts Using an Optically Controlled Microparticle Tool

机译:使用光控微粒工具对微零件进行表面处理的新技术

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This paper focuses on the surface finishing of a micropart made of single-crystal silicon. First, polishing experiments for a rough silicon surface are performed using an optically controlled silica particle with a diameter of 5 μm as a microparticle tool. The root mean square roughness (Rq) of the finished surface in the processed area is 23.2 nm, which is less than the initial surface roughness of 27.1 nm Rq. The fine polishing of a Si wafer specimen with an initial surface roughness of 4.3 nm Rq is then conducted using a silica particle with a diameter of 3 μm. Subsequently, a reference position detection method is introduced. The experimental results reveal that the surface roughness with a spatial wavelength ranging from 1 μm to 10 nm, over an area of several square micrometers, can be improved to the order of nanometers.
机译:本文重点研究由单晶硅制成的微零件的表面处理。首先,使用直径为5μm的光控二氧化硅颗粒作为微粒工具,对粗糙的硅表面进行抛光实验。加工区域中精加工表面的均方根粗糙度(Rq)为23.2 nm,小于初始表面粗糙度27.1 nm Rq。然后使用直径为3μm的二氧化硅颗粒对初始表面粗糙度为4.3 nm Rq的Si晶片样品进行精细抛光。随后,引入参考位置检测方法。实验结果表明,在几平方微米的区域内,空间波长范围为1μm至10 nm的表面粗糙度可以提高到纳米级。

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