Gold alloys wire offers superior ball-bond reliability

摘要

Mitsubishi Materials reports that it has developed a series of gold alloy wires, called TOUGHBOND, that provides superior ball-bond reliability for interconnection of semiconductors. A ball bond is created by melting the end of a gold wire, making a ball, and then bonding it to an aluminum pad with ultrasonic power and pressure. A key application for the TOUGHBOND technology is for automotive semiconductor devices, which a press release notes requires high reliability at considerably high ambient temperatures.