首页> 外文期刊>Surface and Interface Analysis: SIA: An International Journal Devoted to the Development and Application of Techniques for the Analysis of Surfaces, Interfaces and Thin Films >Complex interface and growth analysis of single crystalline epi-Si(111)/Y2O3/ Pr2O3/Si(111) heterostructures: Strain engineering by oxide buffer control
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Complex interface and growth analysis of single crystalline epi-Si(111)/Y2O3/ Pr2O3/Si(111) heterostructures: Strain engineering by oxide buffer control

机译:单晶epi-Si(111)/ Y2O3 / Pr2O3 / Si(111)异质结构的复杂界面和生长分析:通过氧化物缓冲液控制进行应变工程

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摘要

Complex oxide heterostructures on Si gain in the field of engineered Si wafers increasing interest as flexible buffer systems for developing virtual Si substrates. Strain engineering of thin epitaxial Si thin films on insulating oxide buffers is of special interest to boost charge carrier mobility for Silicon-on-Insulator (SOI) technologies. The single crystalline Si(111)/Y _2O_3 (111)/Pr_2O_3 (111)/Si(111) heterostructure offers, in principle, the opportunity to grow strain-engineered epitaxial Si(111) layers, realizing compressed, fully relaxed, as well as tensile-strained Si films. This flexibility is based on a thickness-dependence of the Y2O3 lattice constant in the oxide bi-layer buffer: In theory, the Y_2O_3 buffer lattice constant on Pr _2O_3/Si(111) can change from pseudomorphism (bigger than Si) over the Si lattice constant towards a fully relaxed status (smaller than Si). By a detailed interface analysis, using TEM-EELS in combination with an in-situ RHEED-XPS study of the isomorphic Y_2O_3 growth on Pr_2O_3/Si(111), the physical origin of this Y _2O_3 buffer lattice constant variation is identified. It is possible to discriminate between the contributions from chemical mixing effects between the isomorphic oxides Y_2O_3 and Pr _2O_3 on the one hand and true misfit strain relaxation mechanisms in stoichiometric Y_2O_3 on the other hand.
机译:作为工程虚拟硅衬底的柔性缓冲系统,在工程硅晶片领域,硅上复杂的氧化物异质结构得到了越来越多的关注。为了提高绝缘体上硅(SOI)技术的电荷载流子迁移率,在绝缘氧化物缓冲器上进行薄外延Si薄膜的应变工程尤为重要。原则上,单晶Si(111)/ Y _2O_3(111)/ Pr_2O_3(111)/ Si(111)异质结构提供了生长应变工程外延Si(111)层的机会,从而实现了压缩,完全松弛以及拉伸应变的硅膜。这种灵活性基于氧化物双层缓冲区中Y2O3晶格常数的厚度依赖性:理论上,Pr _2O_3 / Si(111)上的Y_2O_3缓冲区晶格常数可以从Si上的伪晶(大于Si)改变晶格常数趋于完全松弛的状态(小于Si)。通过详细的界面分析,结合使用TEM-EELS和对Pr_2O_3 / Si(111)上同构Y_2O_3生长的原位RHEED-XPS研究,可以确定该Y _2O_3缓冲晶格常数变化的物理起源。一方面可以区分同构氧化物Y_2O_3和Pr _2O_3之间的化学混合效应,另一方面可以分辨化学计量Y_2O_3中的真正失配应变松弛机制。

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