Solder bump connection inspection of surface mount devices has been a crucial process in the electronics manufacturing industry. A solder bump connection inspection system has been developed using laser ultrasound and interferometric techniques at Georgia Tech. It can help microelectronics industry to reduce cost, and ensure product quality and reliability. In this paper, the hardware and software developments of the laser ultrasonic-interferometric inspection system are introduced. Results are presented for two case studies involving LGAs that have thermal reliability concern for board-level solder bumps, and flip chips whose solder bump interconnections have real-life production defects.
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